___ 12th IEEE Latin America Symposium on Circuits and System

Iberchip

In order to accommodate to the virtual format, the conference now will extend 1 day more, from Feb. 21 to Feb. 25

IBERCHIP Workshop 2021 goes VIRTUAL

The 27th edition was planned to take place in Arequipa, Peru.
However, in the face of the complicated situation posed by COVID19, IBERCHIP Workshop 2021 will be a fully virtual edition. The Organizing Committee is working to make it a superb virtual event, with real-time interactions.

Papers should be presented following the IEEE Proceedings format: MSWord or Latex.


Arequipa, Perú

February 21-25, 2021

Call for papers
LASCAS
PRIME-LA

IBERCHIP New Deadlines

  • Paper Submission: October 1st, 2020 October 17th, 2020

  • Notification of acceptance: October 25th, 2020 November 6th, 2020

  • Camera-ready papers: November 10th, 2020 November 13th, 2020

IBERCHIP

The IBERCHIP Workshop provides an annual forum to academic and industrial researchers from Iberoamerican countries in which to exchange experiences, share knowledge, and establish relations to foster the development of activities related to the field of microelectronics. Special emphasis is put on the improvement of education and training and in the promotion of joint cooperative projects.

Sponsors
Organizers

Organization

General chairs
  • Carlos Silva Cardenas

    PUCP, Perú

Program chairs
  • Mario Raffo Jara

    PUCP, Perú

  • Alexandra Lackmann Zimpeck

    UCPel, Brazil

Topics of interest

  • Topic 1:Analog and Digital Circuits
  • Topic 2:Mixed-Mode Circuits
  • Topic 3:Biomedical Electronics
  • Topic 4:Communication/RF Circuits
  • Topic 5:Wireless Sensor Networks
  • Topic 6:Nanoelectronics
  • Topic 7:Electronic Design Automation
  • Topic 8:VLSI Systems and Applications
  • Topic 9:FPGA Design and Applications
  • Topic 10:Circuit Testing
  • Topic 11:Fault Tolerant Circuitss
  • Topic 12:Electronics, Systems and Circuits for Space and Nuclear Applications
  • Topic 13:Other topics related to Microelectronics

Program

This section is still under construction.

Papers

Paper Specifications

- English is the official language of the workshop and the preferred choice for preparing manuscripts. However, submissions in either Spanish or Portuguese are also welcomed.
- Use IEEE manuscript templates for conference proceedings available at IEEE Templates to meet the following formatting requirements:

  • Paper length: maximum of 4 pages including figures, tables, and references.
  • Paper size: US letter (8.5" x 11") or A4 (210mm X 297mm).
  • File Format: Adobe PDF (.pdf).
  • Do NOT page number your paper.

Please, submit your paper (PDF) using the Easy Chair System. Email submission will not be accepted.

Deadlines

  • Paper Submission: October 1st, 2020 October 17th, 2020
  • Notification of acceptance: October 25th, 2020 November 6th, 2020
  • Camera-ready papers: November 10th, 2020 November 13th, 2020

Contact us for more information

Conference contacts

Name:

Carlos Silva Cardenas

Location:

PUCP, Perú

Email:

csilva@pucp.edu.pe

Name:

Mario Raffo Jara

Location:

PUCP, Perú

Email:

mraffo@pucp.edu.pe

Name:

Alexandra Lackmann Zimpeck

Location:

UCPel, Brazil

Email:

alexandra.zimpeck@ucpel.edu.br

Registration

LASCAS 2021 registration site is now open!

Registration